GHSA-3XCC-MW3V-CG8G高危未审查

无摘要

OSV 1.4.0 · unreviewed · 修改于 2022-01-13 08:01

发布时间

2022-01-04 08:00

GitHub 审查时间

—

NVD 发布时间

2022-01-03 16:15

源文件

advisories/unreviewed/2022/01/GHSA-3xcc-mw3v-cg8g/GHSA-3xcc-mw3v-cg8g.json

公告说明

Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking

受影响的软件包

该公告没有提供结构化的受影响软件包信息。

参考链接

ADVISORYhttps://nvd.nist.gov/vuln/detail/CVE-2021-30298

标识信息

别名 / CVE

CVE-2021-30298

CWE

CWE-120

软件生态

无

扩展资料

暂无扩展资料。

CVSS 评分

没有 CVSS 数据。

原始 OSV JSON

{
  "id": "GHSA-3xcc-mw3v-cg8g",
  "aliases": [
    "CVE-2021-30298"
  ],
  "details": "Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking",
  "affected": [],
  "modified": "2022-01-13T00:01:41Z",
  "severity": [],
  "published": "2022-01-04T00:00:58Z",
  "references": [
    {
      "url": "https://nvd.nist.gov/vuln/detail/CVE-2021-30298",
      "type": "ADVISORY"
    },
    {
      "url": "https://www.qualcomm.com/company/product-security/bulletins/december-2021-bulletin",
      "type": "WEB"
    }
  ],
  "schema_version": "1.4.0",
  "database_specific": {
    "cwe_ids": [
      "CWE-120"
    ],
    "severity": "HIGH",
    "github_reviewed": false,
    "nvd_published_at": "2022-01-03T08:15:00Z",
    "github_reviewed_at": null
  }
}